E466113 YXD-ML Multilayer Printed Wiring Board by Asiatech Group
  • E466113 YXD-ML Multilayer Printed Wiring Board by Asiatech Group
  • E466113 YXD-ML Multilayer Printed Wiring Board by Asiatech Group

ELECTRONIC BOARD 0-901-49-249-7 KRONES 0-901-68-962-0 001373 01.22 YX E466113 YXD-ML

YXD-ML

The E466113 YXD-ML is a multilayer printed wiring board (PWB) manufactured by Asiatech Group (Huizhou) Ltd., designed for complex electronic applications requiring reliable multilayer circuitry. CRC

$2,900.00
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1 Item

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Description

The E466113 YXD-ML is a multilayer printed wiring board produced by Asiatech Group (Huizhou) Ltd., a company certified under UL file number E466113. This PWB is engineered to support intricate electronic circuits across multiple layers, facilitating compact and efficient designs. The board is constructed with a minimum conductor width of 0.075 mm and a minimum conductor thickness of 17 microns, ensuring precise signal transmission. It accommodates a maximum conductor thickness of 102 microns for both internal and external layers, providing flexibility in design specifications. The PWB is suitable for double-sided (DS) applications with a maximum area diameter of 50.8 mm. It is rated for a maximum operating temperature of 130°C and meets the UL 94V-0 flame class, indicating its compliance with stringent safety standards.

Features:

  • Multilayer Construction: Supports complex circuitry across multiple layers.
  • Conductor Specifications:
    • Minimum Width: 0.075 mm
    • Minimum Thickness: 17 microns
    • Maximum Thickness: 102 microns (internal and external layers)
  • Application Type: Double-sided (DS) with a maximum area diameter of 50.8 mm.
  • Temperature Rating: Maximum operating temperature of 130°C.
  • Flame Class: UL 94V-0, ensuring high safety standards.
Product Details
YXD-ML
E466113
1 Item
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